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微距測量與3D物件偵測 – 智合科技

微距測量與3D物件偵測

【微距測量與3D物件偵測】是一種可以精確模擬量測微小物體和環境的一種技術。它結合了人工智能科技和微小量測科技,通過精確測量技術來模擬物體的細微形貌,並進一步發展智能分析和權衡的技術。AI奈米測量可以提供高精度的量測,可以用於量測各種形狀,體積,曲面,線等特徵。它也可以測量多層次的微小物體,例如半導體器件,紡織品,生物材料等。此外,AI奈米測量可以用於自動和半自動的測量工作,像自動分析圖像,測量設備的參數以及自動追蹤物件的位置等等。
我們採用AOI的先行技術,再以AI進行標注及訓練,進行微米級(µm)甚至奈米(nm)級的物件測量,提升原物料及產品的檢驗準確性。
孔機鑽針刃面研磨檢查設備
2.5D/3D測量儀
微文字/二維碼品質溯源追蹤系統